Invention Grant
- Patent Title: Mounting apparatus for power supply unit
- Patent Title (中): 电源装置安装装置
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Application No.: US13070911Application Date: 2011-03-24
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Publication No.: US08553418B2Publication Date: 2013-10-08
- Inventor: Nai-Juan Li , Zhi-Ping Wu
- Applicant: Nai-Juan Li , Zhi-Ping Wu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201010242444 20100802
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An assembly includes a power supply unit, a base, and an enclosure. The base includes a bottom plate. The enclosure includes a bottom panel. A flexible piece is connected to the bottom panel. The power supply unit is located on the bottom panel. The bottom panel is located on the bottom plate of the base. The flexible piece is located between the power supply unit and the bottom plate, and is elastically bent.
Public/Granted literature
- US20120026655A1 MOUNTING APPARATUS FOR POWER SUPPLY UNIT Public/Granted day:2012-02-02
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