Invention Grant
- Patent Title: Integrated circuits for accessing USB device
- Patent Title (中): 用于访问USB设备的集成电路
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Application No.: US13666435Application Date: 2012-11-01
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Publication No.: US08554977B2Publication Date: 2013-10-08
- Inventor: Wen-Yu Tseng
- Applicant: Via Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW98108207A 20090313
- Main IPC: G06F13/00
- IPC: G06F13/00

Abstract:
An integrated circuit for accessing a universal serial bus (USB) device via a USB 3.0 receptacle is provided. The integrated circuit includes a plurality of pins and a controlling unit. The pins include a first group for coupling to a first pair of differential pins of the USB receptacle, a second group for coupling to a second pair of differential pins of the USB receptacle, a third group for coupling to a third pair of differential pins to the USB receptacle, a ground pin, a first and second power pins. The second group is disposed between the first and third groups. The controlling unit controls the plurality of pins to receive or transmit the USB 2.0 or USB 3.0 signals.
Public/Granted literature
- US20130059453A1 INTEGRATED CIRCUITS Public/Granted day:2013-03-07
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