Invention Grant
- Patent Title: Method of manufacturing a molded printed circuit board
- Patent Title (中): 制造模制印刷电路板的方法
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Application No.: US12765915Application Date: 2010-04-23
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Publication No.: US08555493B2Publication Date: 2013-10-15
- Inventor: Bo Xu , Yanmin Mao
- Applicant: Bo Xu , Yanmin Mao
- Applicant Address: CA Mississauga
- Assignee: Psion, Inc.
- Current Assignee: Psion, Inc.
- Current Assignee Address: CA Mississauga
- Agent Randi L. Karpinia; Michael J. Giannetta
- Main IPC: H01K3/22
- IPC: H01K3/22
Abstract:
Described herein is a method of manufacturing a molded printed circuit board. The printed circuit board may be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material may have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards may allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be molded with components or a dock attached to it.
Public/Granted literature
- US20110261543A1 Molded Printed Circuit Board Public/Granted day:2011-10-27
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