发明授权
- 专利标题： Method of manufacturing a molded printed circuit board
- 专利标题（中）： 制造模制印刷电路板的方法
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申请号： US12765915申请日： 2010-04-23
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公开(公告)号： US08555493B2公开(公告)日： 2013-10-15
- 发明人: Bo Xu , Yanmin Mao
- 申请人： Bo Xu , Yanmin Mao
- 申请人地址： CA Mississauga
- 专利权人： Psion, Inc.
- 当前专利权人： Psion, Inc.
- 当前专利权人地址： CA Mississauga
- 代理商 Randi L. Karpinia; Michael J. Giannetta
- 主分类号： H01K3/22
- IPC分类号： H01K3/22
摘要：
Described herein is a method of manufacturing a molded printed circuit board. The printed circuit board may be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material may have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards may allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be molded with components or a dock attached to it.
公开/授权文献
- US20110261543A1 Molded Printed Circuit Board 公开/授权日：2011-10-27
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