发明授权
- 专利标题： Composite conductive plastic filler panel
- 专利标题（中）： 复合导电塑料填充板
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申请号： US12712030申请日： 2010-02-24
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公开(公告)号： US08558122B2公开(公告)日： 2013-10-15
- 发明人: Albert Pedoeem , Mahesh Mistry
- 申请人： Albert Pedoeem , Mahesh Mistry
- 申请人地址： JP Kawasaki-shi
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Baker Botts L.L.P.
- 主分类号： H05K9/00
- IPC分类号： H05K9/00
摘要：
A filler panel for blocking an unused portion of a communications system. That filler panel may include an electromagnetic shielding base and a base cover removably coupled to the electromagnetic shielding base. The filler panel may also include an air dam composed substantially of low-cost, nonconductive material coupled to either the electromagnetic shielding base or to the base cover through the electromagnetic shielding base.
公开/授权文献
- US20110203844A1 Composite Conductive Plastic Filler Panel 公开/授权日：2011-08-25
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