发明授权
- 专利标题: Lead frame substrate and method of manufacturing the same, and semiconductor device
- 专利标题(中): 引线框架基板及其制造方法以及半导体器件
-
申请号: US13064205申请日: 2011-03-10
-
公开(公告)号: US08558363B2公开(公告)日: 2013-10-15
- 发明人: Takehito Tsukamoto , Susumu Maniwa , Junko Toda , Yasuhiro Sakai
- 申请人: Takehito Tsukamoto , Susumu Maniwa , Junko Toda , Yasuhiro Sakai
- 申请人地址: JP Tokyo
- 专利权人: Toppan Printing Co., Ltd.
- 当前专利权人: Toppan Printing Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JPP2008-254312 20080930
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A lead frame substrate, includes: a metal plate having first and second surfaces; a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section formed on the first surface; external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals; a second outer frame section formed on the second surface; and a resin layer formed on a gap between the first outer frame and the second outer frame. Each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof throughout a side lower portion of the first surface.