Invention Grant
US08558388B2 Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package
有权
可成形的粘合剂组合物，使用其的半导体封装以及半导体封装的制造方法
- Patent Title: Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package
- Patent Title (中): 可成形的粘合剂组合物，使用其的半导体封装以及半导体封装的制造方法
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Application No.: US13291588Application Date: 2011-11-08
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Publication No.: US08558388B2Publication Date: 2013-10-15
- Inventor: Joon-Yong Park , Yong Seok Han , Jae Jun Lee , Chul Ho Jeong
- Applicant: Joon-Yong Park , Yong Seok Han , Jae Jun Lee , Chul Ho Jeong
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2011-0004268 20110114
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.
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Information query
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