发明授权
- 专利标题: Removable IC package stiffening brace and method
- 专利标题(中): 可拆卸IC封装加强支架及方法
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申请号: US12729922申请日: 2010-03-23
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公开(公告)号: US08559180B2公开(公告)日: 2013-10-15
- 发明人: Paul J. Brown , Alex L. Chan
- 申请人: Paul J. Brown , Alex L. Chan
- 申请人地址: FR Paris
- 专利权人: Alcatel Lucent
- 当前专利权人: Alcatel Lucent
- 当前专利权人地址: FR Paris
- 代理机构: Kramer + Amado, P.C.
- 主分类号: H05K7/00
- IPC分类号: H05K7/00 ; H05K7/02 ; H05K7/04
摘要:
Various exemplary embodiments relate to a brace for use with an integrated circuit (IC), and to an IC package with a brace, having a main body portion and a fastening portion for mechanically fastening the main body portion to the IC, by for example clipping or sliding attachment. Other exemplary embodiments relate to a method of stabilizing an IC during an operation carried out on the IC, such as a soldering operation, involving for example steps of attaching a brace to the IC, performing the operation on the IC, and/or removing the brace after performing the operation.
公开/授权文献
- US20110235283A1 REMOVABLE IC PACKAGE STIFFENING BRACE AND METHOD 公开/授权日:2011-09-29