发明授权
- 专利标题： Single workpiece processing chamber
- 专利标题（中）： 单工件加工室
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申请号： US13299141申请日： 2011-11-17
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公开(公告)号： US08562752B2公开(公告)日： 2013-10-22
- 发明人: Daniel J. Woodruff
- 申请人： Daniel J. Woodruff
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED Materials, Inc.
- 当前专利权人： APPLIED Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Perkins Coie LLP
- 代理商 Kenneth H. Ohriner
- 主分类号： B08B7/04
- IPC分类号： B08B7/04 ; B08B5/04 ; B08B3/00 ; B08B1/02 ; B08B7/00 ; B08B3/14 ; B08B3/12 ; B08B6/00
摘要：
A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receive and/or process semi-conductor wafers. The top of the process chamber also includes a tiltable rim. This rim tilts from a non-inclined position to an inclined position. The wafers may be loaded into and unloaded from the process chamber when the rim is in its inclined position.
公开/授权文献
- US20120060869A1 SINGLE WORKPIECE PROCESSING CHAMBER 公开/授权日：2012-03-15
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