Invention Grant
US08563197B2 Methods, apparatus and computer program products for fabricating masks and semiconductor devices using model-based optical proximity effect correction and lithography-friendly layout 有权
使用基于模型的光学邻近效应校正和光刻友好布局制造掩模和半导体器件的方法,装置和计算机程序产品

Methods, apparatus and computer program products for fabricating masks and semiconductor devices using model-based optical proximity effect correction and lithography-friendly layout
Abstract:
Design rules for circuit patterns of a semiconductor device are identified, and schematic layouts of the circuit patterns are generated according to the design rules. Lithography friendly layout (LFL) circuit patterns are generated from the schematic layouts. Target layout circuit patterns are generated from the LFL circuit patterns. Optical proximity effect correction (OPC) is performed on the target layout circuit patterns to generate OPC circuit patterns. A mask is fabricated from the OPC circuit patterns, and may be used fabricate a semiconductor device.
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