Invention Grant
US08563197B2 Methods, apparatus and computer program products for fabricating masks and semiconductor devices using model-based optical proximity effect correction and lithography-friendly layout
有权
使用基于模型的光学邻近效应校正和光刻友好布局制造掩模和半导体器件的方法,装置和计算机程序产品
- Patent Title: Methods, apparatus and computer program products for fabricating masks and semiconductor devices using model-based optical proximity effect correction and lithography-friendly layout
- Patent Title (中): 使用基于模型的光学邻近效应校正和光刻友好布局制造掩模和半导体器件的方法,装置和计算机程序产品
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Application No.: US12238884Application Date: 2008-09-26
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Publication No.: US08563197B2Publication Date: 2013-10-22
- Inventor: Sung-soo Suh , Suk-joo Lee , Yong-hee Park , Mi-kyeong Lee
- Applicant: Sung-soo Suh , Suk-joo Lee , Yong-hee Park , Mi-kyeong Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A,
- Priority: KR10-2007-0097379 20070927
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Design rules for circuit patterns of a semiconductor device are identified, and schematic layouts of the circuit patterns are generated according to the design rules. Lithography friendly layout (LFL) circuit patterns are generated from the schematic layouts. Target layout circuit patterns are generated from the LFL circuit patterns. Optical proximity effect correction (OPC) is performed on the target layout circuit patterns to generate OPC circuit patterns. A mask is fabricated from the OPC circuit patterns, and may be used fabricate a semiconductor device.
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