Invention Grant
US08564026B2 Chip, method for producing a chip and device for laser ablation
有权
芯片，用于制造芯片的方法和用于激光烧蚀的装置
- Patent Title: Chip, method for producing a chip and device for laser ablation
- Patent Title (中): 芯片，用于制造芯片的方法和用于激光烧蚀的装置
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Application No.: US13248087Application Date: 2011-09-29
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Publication No.: US08564026B2Publication Date: 2013-10-22
- Inventor: Franz-Peter Kalz
- Applicant: Franz-Peter Kalz
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102010046966 20100929
- Main IPC: G01N29/02
- IPC: G01N29/02
Abstract:
In various embodiments, a chip may include a substrate; a coating, the coating covering the substrate at least partially and the coating being designed for being stripped at least partially by means of laser ablation; wherein between the substrate and the coating, a laser detector layer is arranged at least partially, the laser detector layer being designed for generating a detector signal for ending the laser ablation.
Public/Granted literature
- US20120074598A1 CHIP, METHOD FOR PRODUCING A CHIP AND DEVICE FOR LASER ABLATION Public/Granted day:2012-03-29
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