Invention Grant
- Patent Title: Compact ejectable component assemblies in electronic devices
- Patent Title (中): 电子设备中的紧凑型可拆卸组件
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Application No.: US12793980Application Date: 2010-06-04
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Publication No.: US08564965B2Publication Date: 2013-10-22
- Inventor: Jason Sloey , Michelle Yu
- Applicant: Jason Sloey , Michelle Yu
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K1/14

Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.
Public/Granted literature
- US20110255252A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2011-10-20
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