Invention Grant
- Patent Title: Pressure sensor assembly
- Patent Title (中): 压力传感器组件
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Application No.: US13305469Application Date: 2011-11-28
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Publication No.: US08567254B2Publication Date: 2013-10-29
- Inventor: Basavaraja M. Teli , Ian Bentley , Jim Cook
- Applicant: Basavaraja M. Teli , Ian Bentley , Jim Cook
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Seager Tufte & Wickhem LLC.
- Main IPC: G01L15/00
- IPC: G01L15/00

Abstract:
The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.
Public/Granted literature
- US20120067132A1 PRESSURE SENSOR ASSEMBLY Public/Granted day:2012-03-22
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