Invention Grant
- Patent Title: Power electronics assembly with multi-sided inductor cooling
- Patent Title (中): 电力电子组件采用多面电感冷却
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Application No.: US12606803Application Date: 2009-10-27
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Publication No.: US08570132B2Publication Date: 2013-10-29
- Inventor: Yong M. Doo , Mark D. Korich , Konstantinos Triantos
- Applicant: Yong M. Doo , Mark D. Korich , Konstantinos Triantos
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01F27/02
- IPC: H01F27/02

Abstract:
A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors.
Public/Granted literature
- US20110096496A1 POWER ELECTRONICS ASSEMBLY WITH MULTI-SIDED INDUCTOR COOLING Public/Granted day:2011-04-28
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