发明授权
- 专利标题： Carbon laminated enclosure
- 专利标题（中）： 碳层叠外壳
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申请号： US13132119申请日： 2008-12-04
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公开(公告)号： US08570747B2公开(公告)日： 2013-10-29
- 发明人: Chao-Wen Cheng , Mark H Ruch , Mark S Tracy
- 申请人： Chao-Wen Cheng , Mark H Ruch , Mark S Tracy
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 国际申请： PCT/US2008/085534 WO 20081204
- 国际公布： WO2010/065035 WO 20100610
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.
公开/授权文献
- US20110235255A1 Carbon Laminated Enclosure 公开/授权日：2011-09-29