发明授权
- 专利标题: Wide-array inkjet printhead assembly
- 专利标题(中): 宽阵列喷墨打印头组件
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申请号: US13703150申请日: 2010-08-19
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公开(公告)号: US08573739B2公开(公告)日: 2013-11-05
- 发明人: Silam J. Choy , Patrick V. Boyd
- 申请人: Silam J. Choy , Patrick V. Boyd
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 国际申请: PCT/US2010/046014 WO 20100819
- 国际公布: WO2012/023941 WO 20120223
- 主分类号: B41J2/155
- IPC分类号: B41J2/155
摘要:
A wide-array inkjet printhead assembly with die carriers includes a backbone which delivers fluid through a manifold with a number of openings. The openings are spaced apart according to a opening pitch. A plurality of inkjet die includes trenches with a trench pitch which is smaller than the opening pitch. A plurality of die carriers include a plurality of oblique tapered channels, with one end of the oblique tapered channels having pitch matching the opening pitch and interfacing with the backbone and the opposite end of the oblique tapered channels having a pitch matching the trench pitch and interfacing with the inkjet die. A method for assembling a wide-array inkjet printhead assembly is also described.
公开/授权文献
- US20130106954A1 WIDE-ARRAY INKJET PRINTHEAD ASSEMBLY 公开/授权日:2013-05-02
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