发明授权
- 专利标题: Semiconductor device having air gap and method of fabricating the same
- 专利标题(中): 具有气隙的半导体装置及其制造方法
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申请号: US13564117申请日: 2012-08-01
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公开(公告)号: US08575680B2公开(公告)日: 2013-11-05
- 发明人: Yoo-Cheol Shin , Joon-Hee Lee
- 申请人: Yoo-Cheol Shin , Joon-Hee Lee
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2011-0077018 20110802
- 主分类号: H01L29/788
- IPC分类号: H01L29/788
摘要:
A semiconductor device includes tunneling insulating layers on active regions of a substrate, floating gate electrodes on the tunneling insulating layers, an isolation trench within the substrate and the isolation trench defines the active region, spaces the tunneling insulating layers, and isolates the floating gate electrodes. A bottom of the isolation trench is directly in contact with the substrate. The semiconductor device further includes a lower insulating layer on the floating gate electrodes, and a middle insulating layer, an upper insulating layer, and a control gate electrode stacked on the lower insulating layer. The lower insulating layer is configured to hermetically seal a top portion of the isolation trench to define and directly abut an air gap within the isolation trench.
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