Invention Grant
- Patent Title: Semiconductor device having air gap and method of fabricating the same
- Patent Title (中): 具有气隙的半导体装置及其制造方法
-
Application No.: US13564117Application Date: 2012-08-01
-
Publication No.: US08575680B2Publication Date: 2013-11-05
- Inventor: Yoo-Cheol Shin , Joon-Hee Lee
- Applicant: Yoo-Cheol Shin , Joon-Hee Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0077018 20110802
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A semiconductor device includes tunneling insulating layers on active regions of a substrate, floating gate electrodes on the tunneling insulating layers, an isolation trench within the substrate and the isolation trench defines the active region, spaces the tunneling insulating layers, and isolates the floating gate electrodes. A bottom of the isolation trench is directly in contact with the substrate. The semiconductor device further includes a lower insulating layer on the floating gate electrodes, and a middle insulating layer, an upper insulating layer, and a control gate electrode stacked on the lower insulating layer. The lower insulating layer is configured to hermetically seal a top portion of the isolation trench to define and directly abut an air gap within the isolation trench.
Public/Granted literature
- US20130032871A1 SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-02-07
Information query
IPC分类: