发明授权
- 专利标题: Three dimensional semiconductor memory devices and methods of forming the same
- 专利标题(中): 三维半导体存储器件及其形成方法
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申请号: US13323452申请日: 2011-12-12
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公开(公告)号: US08575682B2公开(公告)日: 2013-11-05
- 发明人: Bio Kim , Kihyun Hwang , Jaeyoung Ahn , SeungHyun Lim , Dongwoo Kim
- 申请人: Bio Kim , Kihyun Hwang , Jaeyoung Ahn , SeungHyun Lim , Dongwoo Kim
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Onello & Mello, LLP
- 优先权: KR10-2010-0128412 20101215
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
Provided are three-dimensional semiconductor memory devices and methods of forming the same. The device includes a substrate, conductive patterns stacked on the substrate, and an active pattern penetrating the conductive patterns to be connected to the substrate. The active pattern may include a first doped region provided in an upper portion of the active pattern, and a diffusion-resistant doped region overlapped with at least a portion of the first doped region. The diffusion-resistant doped region may be a region doped with carbon.
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