发明授权
US08575682B2 Three dimensional semiconductor memory devices and methods of forming the same 有权
三维半导体存储器件及其形成方法

Three dimensional semiconductor memory devices and methods of forming the same
摘要:
Provided are three-dimensional semiconductor memory devices and methods of forming the same. The device includes a substrate, conductive patterns stacked on the substrate, and an active pattern penetrating the conductive patterns to be connected to the substrate. The active pattern may include a first doped region provided in an upper portion of the active pattern, and a diffusion-resistant doped region overlapped with at least a portion of the first doped region. The diffusion-resistant doped region may be a region doped with carbon.
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