Invention Grant
- Patent Title: Segmented supply rail configuration for a digital integrated circuit
- Patent Title (中): 用于数字集成电路的分段电源轨配置
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Application No.: US13370374Application Date: 2012-02-10
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Publication No.: US08575761B2Publication Date: 2013-11-05
- Inventor: Remy Chevallier
- Applicant: Remy Chevallier
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics S.A.
- Current Assignee: STMicroelectronics S.A.
- Current Assignee Address: FR Montrouge
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1151526 20110225
- Main IPC: H01L23/522
- IPC: H01L23/522
Abstract:
An array of functional cells includes a subset of cells powered by at least one supply rail. That supply rail is formed of first segments located on a first metallization level and second segments located on a second metallization level with at least one conductor element extending between the first and second segments to electrically connect successive segments of the supply rail.
Public/Granted literature
- US20120217649A1 DIGITAL INTEGRATED CIRCUIT Public/Granted day:2012-08-30
Information query
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