发明授权
- 专利标题： Method and system for predicting shrinkable yield for business assessment of integrated circuit design shrink
- 专利标题（中）： 集成电路设计业务评估收缩收益预测方法与系统收缩
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申请号： US11486521申请日： 2006-07-13
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公开(公告)号： US08577717B2公开(公告)日： 2013-11-05
- 发明人: Chung-Min Fu , Yu-Chyi Harn
- 申请人： Chung-Min Fu , Yu-Chyi Harn
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： G06Q99/00
- IPC分类号： G06Q99/00 ; G06Q30/02 ; G06Q10/04
摘要：
A method and a system for predicting shrinkable yield for business assessment of integrated circuit design shrink are provided. An assessment system is provided to determine cost benefits of a design shrink of an integrated circuit chip. A cost benefit analysis across different design shrink technologies is provided early in the process, so that business decisions regarding employment of design shrinks can be made as early as possible.
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