Invention Grant
- Patent Title: Method for forming three-dimensional pattern
- Patent Title (中): 形成三维图案的方法
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Application No.: US12944739Application Date: 2010-11-12
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Publication No.: US08580485B2Publication Date: 2013-11-12
- Inventor: Chien-Min Chang , Jung-Chin Wu , Wan-Li Chuang
- Applicant: Chien-Min Chang , Jung-Chin Wu , Wan-Li Chuang
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.
Public/Granted literature
- US20110183270A1 METHOD FOR FORMING THREE-DIMENSIONAL PATTERN Public/Granted day:2011-07-28
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