发明授权
- 专利标题: Integrated circuit contact structure and method
- 专利标题(中): 集成电路接触结构及方法
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申请号: US13365030申请日: 2012-02-02
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公开(公告)号: US08580628B2公开(公告)日: 2013-11-12
- 发明人: André P. Labonté , Richard S. Wise , Ying Li , Brett H. Engel
- 申请人: André P. Labonté , Richard S. Wise , Ying Li , Brett H. Engel
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES, Inc.
- 当前专利权人: GLOBALFOUNDRIES, Inc.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: Ingrassia Fisher & Lorenz, P.C.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
An integrated circuit having a mis-alignment tolerant electrical contact is formed by providing a semiconductor containing substrate over which is a first FET gate laterally bounded by a first dielectric region, replacing an upper portion of the first FET gate with a second dielectric region, applying a mask having an opening extending partly over an adjacent source or drain contact region of the substrate and over a part of the second dielectric region above the first FET gate, forming an opening through the first dielectric region extending to the contact region and the part of the second dielectric region, and filling the opening with a conductor making electrical connection with the contact region but electrically insulated from the first FET gate by the second dielectric region. A further FET gate may also be provided having an electrical contact thereto formed separately from the source-drain contact.
公开/授权文献
- US20130200441A1 INTEGRATED CIRCUIT CONTACT STRUCTURE AND METHOD 公开/授权日:2013-08-08
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