发明授权
- 专利标题: Thermally conductive LED assembly
- 专利标题(中): 导热LED组件
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申请号: US11756929申请日: 2007-06-01
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公开(公告)号: US08581393B2公开(公告)日: 2013-11-12
- 发明人: Michael A. Meis , Susan L. Korpela , Jeffrey R. Janssen , Patrick J. Hager , Ellen O. Aeling
- 申请人: Michael A. Meis , Susan L. Korpela , Jeffrey R. Janssen , Patrick J. Hager , Ellen O. Aeling
- 申请人地址: US MN St. Paul
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 当前专利权人地址: US MN St. Paul
- 代理商 Sandra K. Nowak
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
A thermally conductive LED assembly is disclosed. The thermally conductive LED assembly includes an elongate conductor cable having a first conductor and a second conductor extending along a length of the elongate conductor cable and a thermally conducting and electrically insulating polymer layer disposed between first conductor and second conductor and a second electrically insulating polymer layer is disposed on the first conductor or second conductor. The electrically insulating polymer layer having a thermal impedance value in a range from 2.5 to 15 C.°-cm2/W and a plurality of light emitting diodes are disposed along the length of the elongate conductor cable. Each light emitting diode is in electrical communication with the first conductor and the second conductor.
公开/授权文献
- US20080074871A1 THERMALLY CONDUCTIVE LED ASSEMBLY 公开/授权日:2008-03-27
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