Invention Grant
- Patent Title: Method for producing a tight, form-fitting connection
- Patent Title (中): 用于生产紧密形状连接的方法
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Application No.: US12999490Application Date: 2009-06-23
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Publication No.: US08584340B2Publication Date: 2013-11-19
- Inventor: Markus Eglinger , Matthias Gramann
- Applicant: Markus Eglinger , Matthias Gramann
- Applicant Address: DE Nuremberg
- Assignee: Conti Temic microelectronic GmbH
- Current Assignee: Conti Temic microelectronic GmbH
- Current Assignee Address: DE Nuremberg
- Agent W. F. Fasse
- Priority: DE102008030775 20080628
- International Application: PCT/DE2009/000865 WO 20090623
- International Announcement: WO2009/155900 WO 20091230
- Main IPC: B21D39/00
- IPC: B21D39/00
Abstract:
A method is provided for producing a tight, form-fitting connection between a housing cover and a housing body, wherein the housing cover has cover tabs protruding from an edge thereof, and an edge area of the housing body has recesses for respectively receiving the cover tabs. The method involves positioning the housing cover on the housing body and deforming the cover tabs in the housing recesses to produce the tight, form-fitting connection in a single operation with a single tool.
Public/Granted literature
- US20110088241A1 Method for Producing a Tight, Form-Fitting Connection Public/Granted day:2011-04-21
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