Invention Grant
- Patent Title: Glass thick film embedded passive material
- Patent Title (中): 玻璃厚膜嵌入式无源材料
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Application No.: US13359105Application Date: 2012-01-26
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Publication No.: US08585937B2Publication Date: 2013-11-19
- Inventor: Nathan P. Lower , Ross K. Wilcoxon , Alan P. Boone , Nathaniel P. Wyckoff , Brandon C. Hamilton
- Applicant: Nathan P. Lower , Ross K. Wilcoxon , Alan P. Boone , Nathaniel P. Wyckoff , Brandon C. Hamilton
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agent Donna P. Suchy; Daniel M. Barbieri
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/06
Abstract:
A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.
Public/Granted literature
- US20120118623A1 GLASS THICK FILM EMBEDDED PASSIVE MATERIAL Public/Granted day:2012-05-17
Information query
