Invention Grant
- Patent Title: Wafer level interconnection of inverted metamorphic multijunction solar cells
- Patent Title (中): 倒置变质多结太阳能电池晶圆级互连
-
Application No.: US13560663Application Date: 2012-07-27
-
Publication No.: US08586859B2Publication Date: 2013-11-19
- Inventor: Tansen Varghese
- Applicant: Tansen Varghese
- Applicant Address: US NM Albuquerque
- Assignee: Emcore Solar Power, Inc.
- Current Assignee: Emcore Solar Power, Inc.
- Current Assignee Address: US NM Albuquerque
- Main IPC: H01L31/042
- IPC: H01L31/042
Abstract:
A method of forming a plurality of discrete, interconnected solar cells mounted on a carrier by providing a first semiconductor substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell structure; forming a metal back contact layer over the solar cell structure; mounting a carrier on top of the metal back contact; removing the first substrate; and lithographically patterning and etching the solar cell structure to form a plurality of discrete solar cells mounted on the carrier.
Public/Granted literature
- US20130014803A1 WAFER LEVEL INTERCONNECTION OF INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELLS Public/Granted day:2013-01-17
Information query
IPC分类:
