发明授权
- 专利标题: Laminated electronic component including water repellant and manufacturing method therefor
- 专利标题(中): 层压电子部件,包括防水剂及其制造方法
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申请号: US12788340申请日: 2010-05-27
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公开(公告)号: US08587923B2公开(公告)日: 2013-11-19
- 发明人: Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
- 申请人: Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2009-131828 20090601
- 主分类号: H01G4/228
- IPC分类号: H01G4/228 ; H01G4/06
摘要:
A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.