发明授权
US08588511B2 Method and apparatus for automatic measurement of pad geometry and inspection thereof 有权
用于自动测量垫几何形状和检查方法和装置

Method and apparatus for automatic measurement of pad geometry and inspection thereof
摘要:
An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.
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