Invention Grant
- Patent Title: Sintered heat pipe
- Patent Title (中): 烧结热管
-
Application No.: US12461560Application Date: 2009-08-17
-
Publication No.: US08590601B2Publication Date: 2013-11-26
- Inventor: Ke-Chin Lee
- Applicant: Ke-Chin Lee
- Applicant Address: CN
- Assignee: Zhongshan Weiqianq Technology Co., Ltd.
- Current Assignee: Zhongshan Weiqianq Technology Co., Ltd.
- Current Assignee Address: CN
- Agency: Bacon & Thomas, PLLC
- Priority: TW98113162A 20090421
- Main IPC: F28D15/00
- IPC: F28D15/00

Abstract:
A sintered heat pipe having a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. The sintered powder layer is circumferentially sintered onto the inner wall of the tube. The capillary grooves extend from one end of the metal tube but do not extend to the other end of the metal tube, leaving a section of the metal tube uncovered. The sintered powder layer extends from the other end of the metal tube but does not extend to the one end of the metal tube so as to cover the section of the metal tube uncovered by the capillary grooves.
Public/Granted literature
- US20100263833A1 Sintered heat pipe Public/Granted day:2010-10-21
Information query