发明授权
- 专利标题： Solder and electrically conductive adhesive based interconnection for CZT crystal attach
- 专利标题（中）： 用于CZT晶体连接的焊料和导电粘合剂基互连
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申请号： US13358716申请日： 2012-01-26
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公开(公告)号： US08592299B1公开(公告)日： 2013-11-26
- 发明人: Voya R. Markovich , Rabindra N. Das , Rajinder S. Rai , Michael Vincent
- 申请人： Voya R. Markovich , Rabindra N. Das , Rajinder S. Rai , Michael Vincent
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell, LLP
- 代理商 Mark Levy
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A structure for minimizing resistance between a semi-insulating x-ray detector crystal and an electrically conducting substrate. Electrical contact pads are disposed on the detector crystal and on the substrate with an electrical interconnect between the contact pads formed from a conductive adhesive and washed solder in electrical and mechanical communication with the pads.
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