Invention Grant
- Patent Title: Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same
- Patent Title (中): 印刷电路板组装面板，用于包装印刷电路板的单元片，刚性柔性板及其制造方法
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Application No.: US11547715Application Date: 2005-04-04
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Publication No.: US08592686B2Publication Date: 2013-11-26
- Inventor: Atsushi Kobayashi , Kazuo Umeda , Wataru Gotou , Takahiro Sahara , Susumu Nakazawa , Kiyoshi Takeuchi , Takayuki Terauchi
- Applicant: Atsushi Kobayashi , Kazuo Umeda , Wataru Gotou , Takahiro Sahara , Susumu Nakazawa , Kiyoshi Takeuchi , Takayuki Terauchi
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2004-116275 20040409; JPP2004-347175 20041130
- International Application: PCT/JP2005/006593 WO 20050404
- International Announcement: WO2005/099324 WO 20051020
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.
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