- 专利标题: Nonvolatile semiconductor memory device and manufacturing method thereof
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申请号: US13109985申请日: 2011-05-17
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公开(公告)号: US08592789B2公开(公告)日: 2013-11-26
- 发明人: Yoshitaka Sasago , Masaharu Kinoshita , Mitsuharu Tai , Takashi Kobayashi
- 申请人: Yoshitaka Sasago , Masaharu Kinoshita , Mitsuharu Tai , Takashi Kobayashi
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2010-114372 20100518
- 主分类号: H01L45/00
- IPC分类号: H01L45/00
摘要:
In a nonvolatile semiconductor memory device, there is provided a technique which promotes microfabrication by reducing a thickness of the device as suppressing an OFF current of a polysilicon diode which is a selective element. A polysilicon layer to which an impurity is doped at low concentration and which becomes an electric-field relaxation layer of the polysilicon diode which is a selective element of a resistance variable memory is formed so as to be divided into two or more layers such as polysilicon layers. In this manner, it is suppressed to form the crystal grain boundaries thoroughly penetrating between an n-type polysilicon layer and a p-type polysilicon layer in the electric-field relaxation layer, and therefore, it is prevented to generate a leakage current flowing through the crystal grain boundaries in application of a reverse-bias voltage without increasing a height of the polysilicon diode.
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