Invention Grant
- Patent Title: Omnibus logic element for packing or fracturing
- Patent Title (中): 用于包装或压裂的综合逻辑元件
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Application No.: US13539007Application Date: 2012-06-29
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Publication No.: US08593174B1Publication Date: 2013-11-26
- Inventor: James Schleicher , Richard Yuan , Bruce Pedersen , Sinan Kaptanoglu , Gregg Baeckler , David Lewis , Mike Hutton , Andy Lee , Rahul Saini , Henry Kim
- Applicant: James Schleicher , Richard Yuan , Bruce Pedersen , Sinan Kaptanoglu , Gregg Baeckler , David Lewis , Mike Hutton , Andy Lee , Rahul Saini , Henry Kim
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H03K19/177
- IPC: H03K19/177
Abstract:
Disclosed is a logic element (LE) that can provide a number of advantageous features. For example, the LE can be configured to implement register packing and/or a fracturable look up table.
Information query
IPC分类:
