Invention Grant
- Patent Title: Conductive paste and method for manufacturing multilayer printed wiring board using the same
- Patent Title (中): 导电浆料和使用其制造多层印刷线路板的方法
-
Application No.: US11664393Application Date: 2005-09-26
-
Publication No.: US08597459B2Publication Date: 2013-12-03
- Inventor: Yoshio Oka , Hitoshi Takii , Noriki Hayashi
- Applicant: Yoshio Oka , Hitoshi Takii , Noriki Hayashi
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPP2004-286499 20040930
- International Application: PCT/JP2005/017591 WO 20050926
- International Announcement: WO2006/035692 WO 20060406
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00

Abstract:
There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.
Public/Granted literature
- US20080099121A1 Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same Public/Granted day:2008-05-01
Information query