Invention Grant
- Patent Title: Device housing and method for making the same
- Patent Title (中): 设备外壳及其制作方法
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Application No.: US13571002Application Date: 2012-08-09
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Publication No.: US08597744B2Publication Date: 2013-12-03
- Inventor: Xin-Wu Guan , Chao-Sheng Huang , Ren-Bo Wang
- Applicant: Xin-Wu Guan , Chao-Sheng Huang , Ren-Bo Wang
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201110322923 20111021
- Main IPC: B29D22/00
- IPC: B29D22/00
Abstract:
A device housing includes a substrate and a decorative article formed in the substrate. The substrate defines a cutout therein and the decorative article is received in the cutout and bonded with the substrate. The decorative article is a glass article which is formed in the cutout by molding softened glass material into the cutout. A method for making the device housing is also provided.
Public/Granted literature
- US20130101765A1 DEVICE HOUSING AND METHOD FOR MAKING THE SAME Public/Granted day:2013-04-25
Information query
