Invention Grant
- Patent Title: Defect inspection device and inspection method
- Patent Title (中): 缺陷检查装置及检验方法
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Application No.: US13378418Application Date: 2010-06-09
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Publication No.: US08599369B2Publication Date: 2013-12-03
- Inventor: Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda
- Applicant: Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-144881 20090618
- International Application: PCT/JP2010/003826 WO 20100609
- International Announcement: WO2010/146799 WO 20101223
- Main IPC: G01N21/47
- IPC: G01N21/47 ; G01N21/55

Abstract:
A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.
Public/Granted literature
- US20120133928A1 DEFECT INSPECTION DEVICE AND INSPECTION METHOD Public/Granted day:2012-05-31
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