Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
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Application No.: US13660449Application Date: 2012-10-25
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Publication No.: US08603899B2Publication Date: 2013-12-10
- Inventor: Taketomi Asami , Mitsuhiro Ichijo , Satoshi Toriumi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2000-209136 20000710
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamber with the above film formation condition, crystallization is not sufficiently attained in a crystallization process. By forming the amorphous silicon film using silane gas diluted with hydrogen, crystallization is sufficiently attained in the crystallization process even with the continuous formation of the base film through the amorphous silicon film in the single film forming chamber.
Public/Granted literature
- US20130059404A1 Method of Manufacturing A Semiconductor Device Public/Granted day:2013-03-07
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