Invention Grant
- Patent Title: Board reinforcing structure, board assembly, and electronic device
- Patent Title (中): 板加强结构,电路板组装和电子设备
-
Application No.: US13075895Application Date: 2011-03-30
-
Publication No.: US08604347B2Publication Date: 2013-12-10
- Inventor: Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
- Applicant: Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire Sanders (US) LLP
- Priority: JP2010-133372 20100610
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K7/00 ; H01L23/58

Abstract:
Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
Public/Granted literature
- US20110303441A1 BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE Public/Granted day:2011-12-15
Information query