发明授权
- 专利标题： Method of making a connection component with posts and pads
- 专利标题（中）： 使用柱和垫制作连接部件的方法
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申请号： US13155825申请日： 2011-06-08
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公开(公告)号： US08604348B2公开(公告)日： 2013-12-10
- 发明人: Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
- 申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/16
摘要：
A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
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