Invention Grant
US08607999B2 Laminated synthetic resin bottle, injection molding device, and process for molding a laminated preform
有权
层合合成树脂瓶,注射成型装置以及层压预成型件的成型方法
- Patent Title: Laminated synthetic resin bottle, injection molding device, and process for molding a laminated preform
- Patent Title (中): 层合合成树脂瓶,注射成型装置以及层压预成型件的成型方法
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Application No.: US13001212Application Date: 2009-06-29
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Publication No.: US08607999B2Publication Date: 2013-12-17
- Inventor: Tamotsu Toyoda , Hiroshi Hosokoshiyama , Yasuhiro Ishizawa , Hideaki Soyama
- Applicant: Tamotsu Toyoda , Hiroshi Hosokoshiyama , Yasuhiro Ishizawa , Hideaki Soyama
- Applicant Address: JP Tokyo
- Assignee: Yoshino Kogyosho CO., Ltd.
- Current Assignee: Yoshino Kogyosho CO., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-171868 20080630; JP2008-171870 20080630
- International Application: PCT/JP2009/061820 WO 20090629
- International Announcement: WO2010/001842 WO 20100107
- Main IPC: B65D23/00
- IPC: B65D23/00

Abstract:
A biaxially drawn, blow molded bottle characterized in that vertical connecting zones having no intermediate layer and having substrate layers welded directly with each other are formed in parallel in a circumferential direction and in a plural number along an axial direction of the bottle and are disposed on both right and left sides of each intermediate layer segment to be formed in this height range, and that horizontal connecting zones having no intermediate layer and having substrate layers welded directly with each other are also formed in parallel in an axial direction and in a plural number along a circumferential direction of the bottle and are disposed on both upper and lower sides of each intermediate layer segment to be formed, thus allowing the intermediate layer to be segmentalized in the circumferential and axial directions by both the vertical and horizontal connecting zones.
Public/Granted literature
- US20110108505A1 LAMINATED SYNTHETIC RESIN BOTTLE, INJECTION MOLDING DEVICE, AND PROCESS FOR MOLDING A LAMINATED PREFORM Public/Granted day:2011-05-12
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