发明授权
- 专利标题： Method and apparatus for accurate die-to-wafer bonding
- 专利标题（中）： 用于准确的晶片到晶片键合的方法和装置
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申请号： US13267025申请日： 2011-10-06
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公开(公告)号： US08609446B2公开(公告)日： 2013-12-17
- 发明人: Chyi Shyuan Chern , Hsin-Hsien Wu , Chih-Kuang Yu , Hung-Yi Kuo
- 申请人： Chyi Shyuan Chern , Hsin-Hsien Wu , Chih-Kuang Yu , Hung-Yi Kuo
- 申请人地址： TW Hsinchu
- 专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.
公开/授权文献
- US20130089937A1 METHOD AND APPARATUS FOR ACCURATE DIE-TO-WAFER BONDING 公开/授权日：2013-04-11