Invention Grant
US08611097B2 Serial advanced technology attachment dual in-line memory module assembly
失效
串行高级技术附件双列直插式内存模组装配
- Patent Title: Serial advanced technology attachment dual in-line memory module assembly
- Patent Title (中): 串行高级技术附件双列直插式内存模组装配
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Application No.: US13339407Application Date: 2011-12-29
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Publication No.: US08611097B2Publication Date: 2013-12-17
- Inventor: Xiao-Gang Yin , Wei-Min He , Guo-Yi Chen
- Applicant: Xiao-Gang Yin , Wei-Min He , Guo-Yi Chen
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110408514 20111209
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11

Abstract:
A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector connected to the expansion slot is arranged on a top edge of the first circuit board and includes second power pins connected to the first power pins, second ground pins, and four first signal pins connected to the control chip. A third edge connector engaged in the expansion slot is arranged on a bottom edge of the second circuit board and includes third power pins and four second signal pins connected to the second storage chips, and third ground pins.
Public/Granted literature
- US20130151745A1 SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE ASSEMBLY Public/Granted day:2013-06-13
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