A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip.