Invention Grant
- Patent Title: Dicing film with protecting film
- Patent Title (中): 带保护膜的切片膜
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Application No.: US13415524Application Date: 2012-03-08
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Publication No.: US08614139B2Publication Date: 2013-12-24
- Inventor: Yuichiro Shishido , Takeshi Matsumura
- Applicant: Yuichiro Shishido , Takeshi Matsumura
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2011-054304 20110311
- Main IPC: H01L21/46
- IPC: H01L21/46
Abstract:
The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm.
Public/Granted literature
- US20120231236A1 DICING FILM WITH PROTECTING FILM Public/Granted day:2012-09-13
Information query
IPC分类:
