Invention Grant
- Patent Title: Photovoltaic module mounting system
- Patent Title (中): 光伏组件安装系统
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Application No.: US13317142Application Date: 2011-10-11
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Publication No.: US08615939B2Publication Date: 2013-12-31
- Inventor: Martin N. Seery , Rodney H. Holland , Jeff Hartnett , Isaac Childress , Todd Pelman
- Applicant: Martin N. Seery , Rodney H. Holland , Jeff Hartnett , Isaac Childress , Todd Pelman
- Applicant Address: US CA San Rafael
- Assignee: SunLink Corporation
- Current Assignee: SunLink Corporation
- Current Assignee Address: US CA San Rafael
- Agency: Reed Smith LLP
- Main IPC: E04D13/18
- IPC: E04D13/18
Abstract:
A photovoltaic module mounting system using clamps to attach the modules to a mounting structure, thereby providing a universal mounting structure for use with laminate or framed modules of differing shapes and sizes, from different manufacturers.
Public/Granted literature
- US20120061337A1 Photovoltaic module mounting system Public/Granted day:2012-03-15
Information query
