A heat-sensitive adhesive label manufacturing device has a thermal head for heating and thermally activating the heat-sensitive adhesive layer of a heat-sensitive adhesive sheet, and a platen roller for conveying the heat-sensitive adhesive sheet between the platen roller and the thermal head to transport the heat-sensitive adhesive sheet in a transport direction. At least one discharge roller is disposed on a downstream side of the thermal activation section and is configured to undergo rotation at a peripheral speed different from a peripheral speed of the platen roller to convey the heat-sensitive adhesive sheet in the transport direction. A guide member is disposed opposite and spaced apart from the at least one discharge roller to provide a space therebetween along which the heat-sensitive adhesive sheet is conveyed by the at least one discharge roller without being sandwiched between the at least one discharge roller and the guide member.