Invention Grant
- Patent Title: Dual curing polymers and methods for their preparation and use
- Patent Title (中): 双固化聚合物及其制备和使用方法
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Application No.: US12517211Application Date: 2007-11-07
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Publication No.: US08618233B2Publication Date: 2013-12-31
- Inventor: Khristopher Alvarez , Nick Shephard , James Tonge
- Applicant: Khristopher Alvarez , Nick Shephard , James Tonge
- Applicant Address: US MI Midland
- Assignee: Dow Corning Corporation
- Current Assignee: Dow Corning Corporation
- Current Assignee Address: US MI Midland
- Agent Claude F. Purchase
- International Application: PCT/US2007/023467 WO 20071107
- International Announcement: WO2008/076184 WO 20080626
- Main IPC: C08G77/08
- IPC: C08G77/08

Abstract:
A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
Public/Granted literature
- US20100092690A1 Dual Curing Polymers and Methods for Their Preparation and Use Public/Granted day:2010-04-15
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