发明授权
- 专利标题： Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
- 专利标题（中）： 电子设备案例，制造方法和模具以及移动通信终端
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申请号： US12608818申请日： 2009-10-29
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公开(公告)号： US08618989B2公开(公告)日： 2013-12-31
- 发明人: Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Dae Seong Jeon , Ki Won Chang , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam Il Seo
- 申请人： Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Dae Seong Jeon , Ki Won Chang , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam Il Seo
- 申请人地址： KR Suwon, Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon, Gyunggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2009-0035635 20090423
- 主分类号： H01Q1/24
- IPC分类号： H01Q1/24
摘要：
An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.