A flap transfer valve is disclosed for the transfer of semiconductor elements or substrates into a semiconductor or substrate processing process chamber having an elongated first opening, which is surrounded in the form of a frame by a first sealing surface on a first sealing plane, and an elongated valve closure beam, having a second sealing surface which corresponds to the first sealing surface, can be brought into gas-tight contact with it, and is located on a second sealing plane. A support is arranged on the rear face of the valve closure beam, which is arranged such that it can pivot through a limited pivoting angle about a tilting axis. The support together with the valve closure beam can pivot about a pivoting axis, which lies on the first sealing plane, and the tilting axis lies on the second sealing plane.