Invention Grant
- Patent Title: Through hole forming method, nozzle plate and MEMS device
- Patent Title (中): 通孔成型方法，喷嘴板和MEMS器件
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Application No.: US13409604Application Date: 2012-03-01
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Publication No.: US08623769B2Publication Date: 2014-01-07
- Inventor: Miho Shiraki , Junichi Takeuchi
- Applicant: Miho Shiraki , Junichi Takeuchi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-044778 20110302
- Main IPC: H01L21/301
- IPC: H01L21/301 ; H01L21/302 ; F15D1/08
Abstract:
A through hole forming method includes forming a plurality of small holes in a first substrate surface of a substrate including the first substrate surface and a second substrate surface as a back surface of the first substrate surface, forming a thermally oxidized film by thermally oxidizing partition walls between the adjacent small holes and bottoms of the small holes, and removing the thermally oxidized film.
Public/Granted literature
- US20120223615A1 THROUGH HOLE FORMING METHOD, NOZZLE PLATE AND MEMS DEVICE Public/Granted day:2012-09-06
Information query
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